Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852672 | Test circuit and method | Mill-Jer Wang, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2023-12-26 |
| 11726112 | Electromagnetic shielding during wafer stage testing | Hsien-Tang Wang, Mill-Jer Wang, Chi-Chang Lai | 2023-08-15 |
| 11579190 | Testing holders for chip unit and die package | Mill-Jer Wang, Kuo-Chuan Liu, Hung-Chih Lin, Hao Chen | 2023-02-14 |