Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804445 | Method for forming chip package structure | Fu-Jen Li, Pei-Haw Tsao, Shyue-Ter Leu | 2023-10-31 |
| 11764123 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Kuan-Yu Huang, Shu-Chia Hsu +1 more | 2023-09-19 |
| 11694939 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Kuan-Yu Huang, Shu-Chia Hsu +1 more | 2023-07-04 |