Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2023-12-12 |
| 11764123 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Shu-Chia Hsu +1 more | 2023-09-19 |
| 11705407 | Package structure and fabricating method thereof | Sung-Hui Huang, Shang-Yun Hou | 2023-07-18 |
| 11699674 | Semiconductor package and method of forming the same | Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2023-07-11 |
| 11694939 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Shu-Chia Hsu +1 more | 2023-07-04 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2023-04-04 |
| 11587886 | Semiconductor device | Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2023-02-21 |
| 11569156 | Semiconductor device, electronic device including the same, and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou | 2023-01-31 |