Issued Patents 2023
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855003 | Package structure and method of fabricating the same | Pu Wang, Li-Hui Cheng, Hsien-Ju Tsou | 2023-12-26 |
| 11855060 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Chin-Fu Kao, Pu Wang | 2023-12-26 |
| 11855054 | Method of forming package structure | Chih-Chien Pan, Chin-Fu Kao, Li-Hui Cheng | 2023-12-26 |
| 11854984 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Tsung-Fu Tsai | 2023-12-26 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11830821 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Li-Hui Cheng | 2023-11-28 |
| 11824040 | Package component, electronic device and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih | 2023-11-21 |
| 11817425 | Package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Shih-Ting Lin | 2023-11-14 |
| 11817410 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Shih-Ting Lin | 2023-11-14 |
| 11810831 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Ying-Ching Shih | 2023-11-07 |
| 11804468 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Li-Hui Cheng | 2023-10-31 |
| 11769739 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Chen-Hsuan Tsai, I-Ting Huang | 2023-09-26 |
| 11756855 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2023-09-12 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Ying-Ching Shih | 2023-09-05 |
| 11742323 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, An-Jhih Su | 2023-08-29 |
| 11728190 | System for thinning substrate | Yi-Chao Mao, Chin-Chuan Chang | 2023-08-15 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11705381 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Li-Hui Cheng | 2023-07-18 |
| 11699597 | Package structure and manufacturing method thereof | Li-Hui Cheng, Ping-Yin Hsieh, Chih-Hao Chen | 2023-07-11 |
| 11694975 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Chih-Wei Wu | 2023-07-04 |
| 11682645 | Plurality of stacked pillar portions on a semiconductor structure | Jung-Hua Chang, Ying-Ching Shih | 2023-06-20 |
| 11670593 | Package-on-package (POP) electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Shih-Ting Lin, Hung-Wei Tsai | 2023-06-06 |
| 11670597 | Method for forming package structure | Chin-Chuan Chang | 2023-06-06 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Chin-Fu Kao | 2023-05-30 |
| 11637086 | Sawing underfill in packaging processes | Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-25 |