Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810793 | Semiconductor packages and methods of forming same | Chung-Yu Lu, Ping-Kang Huang, Shang-Yun Hou | 2023-11-07 |
| 11728278 | Board substrates, three-dimensional integrated circuit structures and methods of forming the same | Chung-Yu Lu, Ping-Kang Huang | 2023-08-15 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2023-08-15 |
| 11715681 | Fan-out package structure and method | Tzu-Wei Chiu | 2023-08-01 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11552054 | Package structure and method of manufacturing the same | Wei-Ting Lin, Ping-Kang Huang, Shang-Yun Hou | 2023-01-10 |
| 11545438 | Semiconductor packages and methods of forming the same | Cheng-Yen Hsieh, Chun-Hui Yu, Ping-Kang Huang, Yi-Jhang Wang | 2023-01-03 |