Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810793 | Semiconductor packages and methods of forming same | Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou | 2023-11-07 |
| 11728278 | Board substrates, three-dimensional integrated circuit structures and methods of forming the same | Ping-Kang Huang, Sao-Ling Chiu | 2023-08-15 |