Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855030 | Package structure and method of manufacturing the same | Hsuan-Ning Shih | 2023-12-26 |
| 11855025 | Semiconductor device and package assembly including the same | Chita Chuang, Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2023-12-26 |
| 11855018 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chen-Hua Yu, Wei-Cheng Wu | 2023-12-26 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng | 2023-09-12 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11676943 | Semiconductor structure and manufacturing method thereof | Chien-Yuan Huang, Shih-Chang Ku | 2023-06-13 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2023-05-16 |
| 11626341 | Package structure | Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Yi-Chung Huang | 2023-04-11 |
| 11594469 | Semiconductor device and method of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Yu Chen, Wensen Hung | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee | 2023-02-14 |