Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei, Hsien-Pin Hu | 2023-11-07 |
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Li-Han Hsu, Chien-Fu Tseng | 2023-09-12 |
| 11721602 | Semiconductor package with stiffener structure | Wensen Hung, Yu-Ling Tsai, Chien-Chia Chiu | 2023-08-08 |
| 11715675 | Semiconductor device and manufacturing method thereof | Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Chien-Yuan Huang +1 more | 2023-08-01 |
| 11699674 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2023-07-11 |
| 11594469 | Semiconductor device and method of manufacture | Shih-Chang Ku, Hung-Chi Li, Tsung-Shu Lin, Wensen Hung | 2023-02-28 |
| 11587845 | Semiconductor structure | Chi-Hsi Wu, Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Hung-Chi Li | 2023-02-21 |