Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721602 | Semiconductor package with stiffener structure | Wensen Hung, Chien-Chia Chiu, Tsung-Yu Chen | 2023-08-08 |
| 11658085 | Integrated circuit package and method | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |