Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721602 | Semiconductor package with stiffener structure | Wensen Hung, Yu-Ling Tsai, Tsung-Yu Chen | 2023-08-08 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Cheng-Hsien Hsieh, Li-Han Hsu, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |