Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Chien-Fu Tseng | 2023-09-12 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2023-05-16 |
| 11638360 | Orientation-adjustment mechanism | Lan-Chun Yang, Chun-Hung Huang, Yi-Chieh Lin | 2023-04-25 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2023-03-21 |
| 11581268 | Semiconductor package with redistribution structure and manufacturing method thereof | Wei-Cheng Wu, Chien-Chia Chiu, Cheng-Hsien Hsieh, Meng-Tsan Lee, Tsung-Shu Lin | 2023-02-14 |
| 11564487 | Connector for modular rack assembly | — | 2023-01-31 |