Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756870 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Tsung-Shu Lin, Wei-Cheng Wu, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng | 2023-09-12 |
CY
Che-Yu Yeh
Overall (2023): #482,216 of 537,848Top 90%
1
Patents 2023