Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11852868 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou | 2023-12-26 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2023-12-05 |
| 11764139 | Semiconductor device and method | Jing-Cheng Lin, Chen-Hua Yu, Po-Hao Tsai | 2023-09-19 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Hsien-Wei Chen, Der-Chyang Yeh, An-Jhih Su, Wei-Yu Chen | 2023-08-08 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2023-05-16 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11587845 | Semiconductor structure | Wensen Hung, Tsung-Shu Lin, Shih-Chang Ku, Tsung-Yu Chen, Hung-Chi Li | 2023-02-21 |