Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2023-12-26 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Po-Hao Tsai +2 more | 2023-12-05 |
| 11823912 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Der-Chyang Yeh | 2023-11-21 |
| 11756931 | Chip package structure with molding layer | Wei-Yu Chen, An-Jhih Su, Hsien-Wei Chen | 2023-09-12 |
| 11742298 | Alignment mark design for packages | Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2023-08-29 |
| 11728249 | Semiconductor package and method | Wei-Yu Chen, An-Jhih Su, Der-Chyang Yeh, Ming-Shih Yeh | 2023-08-15 |
| 11721676 | Package structure with dummy die | Hsien-Wei Chen | 2023-08-08 |
| 11682654 | Semiconductor structure having a sensor device and method of manufacturing the same | Der-Chyang Yeh, Ta-Hsuan Lin, Ming-Shih Yeh | 2023-06-20 |
| 11682637 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Yu-Hsiang Hu | 2023-06-20 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |