Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682637 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu | 2023-06-20 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Shao-Yun Chen, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |