Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Li-Hsien Huang, An-Jhih Su, Ming-Shih Yeh +1 more | 2023-02-21 |
SC
Shao-Yun Chen
Overall (2023): #259,154 of 537,848Top 50%
1
Patents 2023