Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855047 | Chip package structure with conductive shielding film | Chen-Hua Yu, Jing-Cheng Lin, Po-Hao Tsai | 2023-12-26 |
| 11854994 | Redistribution structure for integrated circuit package and method of forming same | Chen-Hua Yu, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2023-12-26 |
| 11842983 | Semiconductor structure | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Tien-Chung Yang | 2023-12-12 |
| 11837587 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai +2 more | 2023-12-05 |
| 11756931 | Chip package structure with molding layer | Wei-Yu Chen, Li-Hsien Huang, Hsien-Wei Chen | 2023-09-12 |
| 11742323 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2023-08-29 |
| 11728249 | Semiconductor package and method | Wei-Yu Chen, Der-Chyang Yeh, Li-Hsien Huang, Ming-Shih Yeh | 2023-08-15 |
| 11721559 | Integrated circuit package pad and methods of forming | Chen-Hua Yu, Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Yu Chen | 2023-08-08 |
| 11715727 | Packages and methods of forming packages | Chen-Hua Yu, Der-Chyang Yeh | 2023-08-01 |
| 11664322 | Multi-stacked package-on-package structures | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11626296 | Fan-out structure and method of fabricating the same | Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |
| 11587900 | Package structure including IPD and method of forming the same | Hua-Wei Tseng, Yueh-Ting Lin, Shao-Yun Chen, Li-Hsien Huang, Ming-Shih Yeh +1 more | 2023-02-21 |