Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855054 | Method of forming package structure | Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2023-12-26 |
| 11855003 | Package structure and method of fabricating the same | Pu Wang, Szu-Wei Lu, Hsien-Ju Tsou | 2023-12-26 |
| 11830821 | Semiconductor devices and methods of manufacture | Chih-Hao Chen, Pu Wang, Szu-Wei Lu | 2023-11-28 |
| 11804468 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Chih-Chien Pan, Pu Wang, Szu-Wei Lu | 2023-10-31 |
| 11756802 | Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device | Jing-Cheng Lin, Po-Hao Tsai | 2023-09-12 |
| 11756855 | Method of fabricating package structure | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu | 2023-09-12 |
| 11742323 | Semiconductor structure and method of forming the same | Chih-Chien Pan, Pu Wang, An-Jhih Su, Szu-Wei Lu | 2023-08-29 |
| 11705381 | High efficiency heat dissipation using thermal interface material film | Chih-Hao Chen, Hung-Yu Chen, Pu Wang, Szu-Wei Lu | 2023-07-18 |
| 11699597 | Package structure and manufacturing method thereof | Szu-Wei Lu, Ping-Yin Hsieh, Chih-Hao Chen | 2023-07-11 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Chin-Fu Kao, Szu-Wei Lu | 2023-05-30 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Szu-Wei Lu, Chih-Chien Pan | 2023-04-11 |
| 11605579 | Semiconductor device having passivation layer and method of manufacturing the same | Jing-Cheng Lin, Po-Hao Tsai | 2023-03-14 |