Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855003 | Package structure and method of fabricating the same | Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2023-12-26 |
HT
Hsien-Ju Tsou
Overall (2023): #420,430 of 537,848Top 80%
1
Patents 2023