Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855054 | Method of forming package structure | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2023-12-26 |
| 11804468 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2023-10-31 |
| 11742323 | Semiconductor structure and method of forming the same | Pu Wang, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu | 2023-08-29 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Li-Hui Cheng, Chin-Fu Kao, Szu-Wei Lu | 2023-05-30 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2023-04-11 |