Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855060 | Package structure and method of fabricating the same | Tsung-Fu Tsai, Pu Wang, Szu-Wei Lu | 2023-12-26 |
| 11855054 | Method of forming package structure | Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2023-12-26 |
| 11764168 | Chip package structure with anchor structure and method for forming the same | Hui-Ting Lin, Chen-Shien Chen | 2023-09-19 |
| 11756855 | Method of fabricating package structure | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu | 2023-09-12 |
| 11749575 | Semiconductor package structure having ring portion with recess for adhesive and method for forming the same | Hui-Ting Lin, Chen-Shien Chen | 2023-09-05 |
| 11742218 | Semiconductor device package having metal thermal interface material and method for forming the same | Chien-Li Kuo, Chen-Shien Chen | 2023-08-29 |
| 11664286 | Method for forming package structure | Chih-Hao Chen, Chih-Chien Pan, Li-Hui Cheng, Szu-Wei Lu | 2023-05-30 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Li-Hui Cheng, Szu-Wei Lu, Chih-Chien Pan | 2023-04-11 |