Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854984 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu | 2023-12-26 |
| 11855060 | Package structure and method of fabricating the same | Chin-Fu Kao, Pu Wang, Szu-Wei Lu | 2023-12-26 |
| 11817425 | Package structure with underfill | Chen-Hsuan Tsai, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11769739 | Package structure and manufacturing method thereof | Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2023-09-26 |
| 11670593 | Package-on-package (POP) electronic device and manufacturing method thereof | Hou-Ju Huang, Shih-Ting Lin, Szu-Wei Lu, Hung-Wei Tsai | 2023-06-06 |