Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817410 | Integrated circuit package and method | Wen-Chih Chiou, Chen-Hua Yu, Szu-Wei Lu | 2023-11-14 |
| 11817425 | Package structure with underfill | Chen-Hsuan Tsai, Tsung-Fu Tsai, Szu-Wei Lu | 2023-11-14 |
| 11769739 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang | 2023-09-26 |
| 11670593 | Package-on-package (POP) electronic device and manufacturing method thereof | Tsung-Fu Tsai, Hou-Ju Huang, Szu-Wei Lu, Hung-Wei Tsai | 2023-06-06 |
| 11574872 | Package structure and method of manufacturing the same | Szu-Wei Lu | 2023-02-07 |
| 11543312 | Spindle shaft device with torque sensor | Chien-Nan Yeh, Pei-Yu Chang, Chao-Ta Huang | 2023-01-03 |