HT

Hung-Wei Tsai

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 Shiliujia, TW: #34 of 78 inventorsTop 45%
Overall (2023): #419,067 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11670593 Package-on-package (POP) electronic device and manufacturing method thereof Tsung-Fu Tsai, Hou-Ju Huang, Shih-Ting Lin, Szu-Wei Lu 2023-06-06