Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854984 | Semiconductor package and manufacturing method thereof | Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai | 2023-12-26 |
| 11817425 | Package structure with underfill | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11769739 | Package structure and manufacturing method thereof | Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, I-Ting Huang | 2023-09-26 |