Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854984 | Semiconductor package and manufacturing method thereof | Chen-Hsuan Tsai, Szu-Wei Lu, Tsung-Fu Tsai | 2023-12-26 |
| 11728190 | System for thinning substrate | Yi-Chao Mao, Szu-Wei Lu | 2023-08-15 |
| 11670597 | Method for forming package structure | Szu-Wei Lu | 2023-06-06 |
| 11616034 | Integrated circuit structure, and method for forming thereof | Yi-Chao Mao, Szu-Wei Lu, Kun-Tong Tsai, Hung Chih Chen | 2023-03-28 |