Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742218 | Semiconductor device package having metal thermal interface material and method for forming the same | Chin-Fu Kao, Chen-Shien Chen | 2023-08-29 |
| 11688762 | Low warpage high density trench capacitor | Jyun-Ying Lin, Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui | 2023-06-27 |
| 11664398 | Image sensor and manufacturing method thereof | Chung-Lei Chen, Clark Lee, Wen-Sheng Wang | 2023-05-30 |
| 11621235 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Kuen-Shian Chen | 2023-04-04 |