Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621235 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Chien-Li Kuo | 2023-04-04 |
KC
Kuen-Shian Chen
Overall (2023): #360,756 of 537,848Top 70%
1
Patents 2023