Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769792 | Trench capacitor profile to decrease substrate warpage | Hsin-Li Cheng, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu +4 more | 2023-09-26 |
| 11688762 | Low warpage high density trench capacitor | Hsin-Li Cheng, Jing-Hwang Yang, Felix Ying-Kit Tsui, Chien-Li Kuo | 2023-06-27 |