SS

Shu-Hui Su

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 Damuzhonghou, TW: #1 of 1 inventorsTop 100%
Overall (2023): #253,851 of 537,848Top 50%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11769792 Trench capacitor profile to decrease substrate warpage Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Ting-Chen Hsu +4 more 2023-09-26