Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764168 | Chip package structure with anchor structure and method for forming the same | Chin-Fu Kao, Chen-Shien Chen | 2023-09-19 |
| 11749575 | Semiconductor package structure having ring portion with recess for adhesive and method for forming the same | Chin-Fu Kao, Chen-Shien Chen | 2023-09-05 |