Issued Patents 2023
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854826 | Metal oxide layered structure and methods of forming the same | Cheng-Lin Huang | 2023-12-26 |
| 11855047 | Chip package structure with conductive shielding film | Chen-Hua Yu, An-Jhih Su, Po-Hao Tsai | 2023-12-26 |
| 11854998 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11854877 | Semiconductor device and manufacturing method of the same | Ying-Ching Shih, Pu Wang, Chen-Hua Yu | 2023-12-26 |
| 11848225 | Apparatus for edge trimming of semiconductor wafers | — | 2023-12-19 |
| 11848247 | Thermal dissipation through seal rings in 3DIC structure | Shih-Yi Syu | 2023-12-19 |
| 11846022 | Thin-film-deposition machine | Ta-Hao Kuo | 2023-12-19 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2023-12-12 |
| 11817437 | Method of forming package structure | Po-Hao Tsai | 2023-11-14 |
| 11791241 | Front-to-back bonding with through-substrate via (TSV) | — | 2023-10-17 |
| 11784094 | Laser lift-off method for separating substrate and semiconductor-epitaxial structure | Tsung-Hua Hsieh | 2023-10-10 |
| 11776935 | Semiconductor device and method of manufacture | Chen-Hua Yu, Po-Hao Tsai | 2023-10-03 |
| 11773319 | Quantum dot particles with passivation layer and manufacturing method thereof | Jung-Hua Chang | 2023-10-03 |
| 11767591 | Detachable atomic layer deposition apparatus for powders | Jung-Hua Chang, Chia-Cheng Ku | 2023-09-26 |
| 11764139 | Semiconductor device and method | Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai | 2023-09-19 |
| 11756802 | Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device | Li-Hui Cheng, Po-Hao Tsai | 2023-09-12 |
| 11739423 | Atomic layer deposition apparatus for coating on fine powders | Jung-Hua Chang, Ta-Hao Kuo, Chia-Cheng Ku | 2023-08-29 |
| 11742310 | Method of manufacturing semiconductor device | Feng-Cheng Hsu | 2023-08-29 |
| 11735456 | Alignment mechanism and alignment method of bonding machine | Jung-Hua Chang, Mao-Chan Chang | 2023-08-22 |
| 11688728 | Integrated circuit structure and method for reducing polymer layer delamination | Jui-Pin Hung, Hsien-Wen Liu, Min-Chen Lin | 2023-06-27 |
| 11685996 | Atomic layer deposition device | — | 2023-06-27 |
| 11658172 | Hybrid bonding with through substrate via (TSV) | — | 2023-05-23 |
| 11652190 | Semiconductor component with oxidized aluminum nitride film and manufacturing method thereof | — | 2023-05-16 |
| 11646220 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2023-05-09 |