Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai | 2023-12-26 |
| 11855067 | Integrated circuit package and method | Chen-Hua Yu, Wen-Chih Chiou | 2023-12-26 |
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Chen-Hua Yu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-12-26 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2023-11-21 |
| 11756883 | Through via structure and method | Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-09-12 |
| 11728314 | Methods of forming integrated circuit packages | Chia-Hao Hsu, Wen-Chih Chiou | 2023-08-15 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Ku-Feng Yang +2 more | 2023-08-15 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2023-08-08 |