Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855021 | Semiconductor structure with through substrate vias and manufacturing method thereof | Yung-Chi Lin, Chen-Hua Yu, Wen-Chih Chiou | 2023-12-26 |
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2023-11-21 |
| 11774675 | Semiconductor device and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Wen-Chih Chiou, Chen-Hua Yu | 2023-10-03 |
| 11756883 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Wen-Chih Chiou | 2023-09-12 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2023-08-15 |
| 11594420 | Semiconductor structure and manufacturing method thereof | Hung-Pin Chang, Wen-Chih Chiou | 2023-02-28 |
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang +4 more | 2023-01-03 |