Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2023-11-21 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2023-08-08 |