Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823979 | Method of forming semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2023-11-21 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin +2 more | 2023-08-15 |
| 11721666 | Isolation bonding film for semiconductor packages and methods of forming the same | Ming-Tsu Chung, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2023-08-08 |
| 11688639 | Semiconductor device and method | Chen-Hua Yu, Hung-Pin Chang, Yi-Hsiu Chen, Wen-Chih Chiou | 2023-06-27 |
| 11585005 | Apparatus and method for wafer pre-wetting | Chen-Yu Tsai, Wen-Chih Chiou | 2023-02-21 |
| 11585008 | Plating apparatus for plating semiconductor wafer and plating method | Chen-Yu Tsai, Wen-Chih Chiou | 2023-02-21 |