Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Lin-Chih Huang, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2023-08-15 |
TW
Tasi-Jung Wu
Overall (2023): #233,238 of 537,848Top 45%
1
Patents 2023