Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728296 | Interconnect structure and method of forming same | Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2023-08-15 |
HL
Hsiao Yun Lo
Overall (2023): #420,511 of 537,848Top 80%
1
Patents 2023