Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756883 | Through via structure and method | Yung-Chi Lin, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-09-12 |
| 11728296 | Interconnect structure and method of forming same | Hsiao Yun Lo, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang +2 more | 2023-08-15 |