Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545392 | Semiconductor component having through-silicon vias | Chen-Hua Yu, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2023-01-03 |
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Cheng-Hung Chang
Overall (2023): #493,404 of 537,848Top 95%
1
Patents 2023