Issued Patents 2023
Showing 1–25 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854785 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2023-12-26 |
| 11854918 | Seal ring between interconnected chips mounted on an integrated circuit | Hsien-Wei Chen, Jie Chen, Chih-Chia Hu | 2023-12-26 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Hsien-Pin Hu, Chen-Hua Yu, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11855042 | Method of manufacturing semiconductor structure | Wen-Chih Chiou, Sung-Feng Yeh | 2023-12-26 |
| 11854921 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen, Tzuan-Horng Liu | 2023-12-26 |
| 11855029 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2023-12-26 |
| 11854967 | Semiconductor packages | Jie Chen, Hsien-Wei Chen | 2023-12-26 |
| 11855063 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Chen-Hua Yu | 2023-12-26 |
| 11856800 | Semiconductor devices with system on chip devices | Chen-Hua Yu, Hsien-Wei Chen, Wen-Chih Chiou, Sung-Feng Yeh | 2023-12-26 |
| 11846802 | Semiconductor structure | Hsien-Wei Chen | 2023-12-19 |
| 11848267 | Functional component within interconnect structure of semiconductor device and method of forming same | Hsien-Wei Chen | 2023-12-19 |
| 11848246 | Integrated circuit package and method | Hsien-Wei Chen, Sung-Feng Yeh | 2023-12-19 |
| 11837579 | Semiconductor structure | Hsien-Wei Chen, Jie Chen, Ching-Jung Yang | 2023-12-05 |
| 11837578 | Package structure | Hsien-Wei Chen, Sung-Feng Yeh | 2023-12-05 |
| 11823989 | Multi-liner TSV structure and method forming same | Chin-Shyh Wang, Chao-Wen Shih | 2023-11-21 |
| 11820650 | Microelectromechanical apparatus having hermitic chamber | Bor-Shiun Lee, Yu-Wen Hsu, Chao-Ta Huang | 2023-11-21 |
| 11817363 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Hsien-Wei Chen | 2023-11-14 |
| 11817426 | Package and method of fabricating the same | Hsien-Wei Chen | 2023-11-14 |
| 11810899 | 3DIC formation with dies bonded to formed RDLs | Chen-Hua Yu, Sung-Feng Yeh | 2023-11-07 |
| 11810883 | Package structure | Hsien-Wei Chen | 2023-11-07 |
| 11810897 | Package structure and method of fabricating the same | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2023-11-07 |
| 11798931 | Semiconductor package | Jie Chen, Hsien-Wei Chen | 2023-10-24 |
| 11789201 | Package, optical device, and manufacturing method of package | Hsien-Wei Chen | 2023-10-17 |
| 11791243 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Hsien-Wei Chen | 2023-10-17 |
| 11791246 | Package structure with photonic die and method | Hsien-Wei Chen, Ying-Ju Chen | 2023-10-17 |