Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Yu-Chia Lai | 2023-12-05 |
| 11837579 | Semiconductor structure | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-12-05 |
| 11784124 | Plurality of different size metal layers for a pad structure | Hsien-Wei Chen, Chia-Wei Tu | 2023-10-10 |
| 11769704 | Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing pattern | Sheng-An Kuo, Hsien-Wei Chen, Jie Chen, Ming-Fa Chen | 2023-09-26 |
| 11682594 | Semiconductor structure including interconnection to probe pad with probe mark | Hsien-Wei Chen, Jie Chen | 2023-06-20 |
| 11562935 | Semiconductor structure | Hsien-Wei Chen, Ming-Fa Chen | 2023-01-24 |