Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2023-12-05 |
CH
Chang-Pin Huang
Overall (2023): #490,137 of 537,848Top 95%
1
Patents 2023