Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2023-12-05 |
| 11631629 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Chih-Hang Tung, Sheng-Tsung Hsiao, Jen-Yu Wang | 2023-04-18 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung, Chen-Hua Yu | 2023-01-31 |