Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688685 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2023-06-27 |
| 11670670 | Manufacturing method of package | Wen-Shiang Liao | 2023-06-06 |
| 11631629 | Semiconductor device and manufacturing method thereof | Chung-Jung Wu, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang | 2023-04-18 |
| 11581281 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Kuo-Chung Yee | 2023-02-14 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Tung-Liang Shao, Jen-Yu Wang, Chung-Jung Wu, Chen-Hua Yu | 2023-01-31 |