Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824021 | Semiconductor package for high-speed data transmission and manufacturing method thereof | Huan-Neng Chen | 2023-11-21 |
| 11791534 | Antenna package for signal transmission | Feng-Wei Kuo | 2023-10-17 |
| 11764173 | Semiconductor package for high-speed data transmission and manufacturing method thereof | Huan-Neng Chen | 2023-09-19 |
| 11749625 | Semiconductor structure including one or more antenna structures | Feng-Wei Kuo | 2023-09-05 |
| 11728291 | Semiconductor arrangement in fan out packaging including magnetic structure around transmission line | Huan-Neng Chen | 2023-08-15 |
| 11719885 | Apparatus for optical coupling and system for communication | Feng-Wei Kuo, Robert Bogdan Staszewski, Jianglin Du | 2023-08-08 |
| 11721883 | Semiconductor package with antenna and method of forming the same | — | 2023-08-08 |
| 11699669 | Semiconductor package device with integrated inductor and manufacturing method thereof | Huan-Neng Chen | 2023-07-11 |
| 11688685 | Integrated fan-out package with 3D magnetic core inductor | Chih-Hang Tung, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2023-06-27 |
| 11682638 | Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure | Huan-Neng Chen | 2023-06-20 |
| 11670670 | Manufacturing method of package | Chih-Hang Tung | 2023-06-06 |
| 11652136 | Semiconductor arrangement | Huan-Neng Chen | 2023-05-16 |
| 11641064 | 3D IC antenna array with laminated high-k dielectric | Feng-Wei Kuo | 2023-05-02 |
| 11635643 | Waveguide structure and method for forming the same | Huan-Neng Chen, Feng-Wei Kuo, Min-Hsiang Hsu, Lan-Chou Cho, Chewn-Pu Jou | 2023-04-25 |
| 11637078 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen | 2023-04-25 |