Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824021 | Semiconductor package for high-speed data transmission and manufacturing method thereof | Wen-Shiang Liao | 2023-11-21 |
| 11804515 | Systems and methods for shielded inductive devices | Feng-Wei Kuo, Chewn-Pu Jou, Lan-Chou Cho, Robert Bogdan Staszewski | 2023-10-31 |
| 11803008 | Optical device and method of manufacturing the same | Chewn-Pu Jou, Lan-Chou Cho, Feng-Wei Kuo | 2023-10-31 |
| 11789296 | Optical modulator and package | Lan-Chou Cho, Chewn-Pu Jou, Feng-Wei Kuo, Min-Hsiang Hsu | 2023-10-17 |
| 11764173 | Semiconductor package for high-speed data transmission and manufacturing method thereof | Wen-Shiang Liao | 2023-09-19 |
| 11740492 | Method and system for generating layout diagram of semiconductor device including waveguide heater and method of forming same | Feng-Wei Kuo, Chewn-Pu Jou, Lan-Chou Cho | 2023-08-29 |
| 11728291 | Semiconductor arrangement in fan out packaging including magnetic structure around transmission line | Wen-Shiang Liao | 2023-08-15 |
| 11713218 | Automatic container landing device based on expert system and control method therefor | En Shao, Xianwu Li | 2023-08-01 |
| 11703379 | Polarization independent optoelectronic device and method | Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho | 2023-07-18 |
| 11699669 | Semiconductor package device with integrated inductor and manufacturing method thereof | Wen-Shiang Liao | 2023-07-11 |
| 11682638 | Semiconductor structure having multiple dielectric waveguide channels and method for forming semiconductor structure | Wen-Shiang Liao | 2023-06-20 |
| 11652136 | Semiconductor arrangement | Wen-Shiang Liao | 2023-05-16 |
| 11637078 | Coaxial through via with novel high isolation cross coupling method for 3D integrated circuits | Feng-Wei Kuo, Wen-Shiang Liao, Chewn-Pu Jou, Lan-Chou Cho, William Wu Shen | 2023-04-25 |
| 11635643 | Waveguide structure and method for forming the same | Feng-Wei Kuo, Min-Hsiang Hsu, Lan-Chou Cho, Chewn-Pu Jou, Wen-Shiang Liao | 2023-04-25 |
| 11616631 | Integrated circuit with radio frequency interconnect | William Wu Shen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, Tze-Chiang Huang +2 more | 2023-03-28 |