Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837562 | Conductive bump of a semiconductor device and fabricating method thereof | Chang-Pin Huang, Tung-Liang Shao, Ching-Jung Yang, Yu-Chia Lai | 2023-12-05 |
| 11735518 | Dual-mode wireless charging device | Shih-Wei Liang, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2023-08-22 |