Issued Patents 2023
Showing 1–25 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855016 | Semiconductor device and method of manufacture | Chen-Hua Yu, Tin-Hao Kuo, Chung-Shi Liu | 2023-12-26 |
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Wei-Kang Hsieh, Shih-Wei Chen, Tin-Hao Kuo | 2023-12-26 |
| 11855232 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu +2 more | 2023-12-26 |
| 11848288 | Semiconductor device and method | Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Ming Hung Tseng | 2023-12-19 |
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Tin-Hao Kuo, Tzung-Hui Lee +1 more | 2023-12-19 |
| 11847852 | Manufacturing method of fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +1 more | 2023-12-19 |
| 11848319 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Tin-Hao Kuo, Chung-Shi Liu +1 more | 2023-12-19 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Chih-Wei Lin, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11842993 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai +2 more | 2023-12-12 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo +1 more | 2023-12-05 |
| 11837517 | Packaged semiconductor devices with wireless charging means | Chen-Hua Yu, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2023-12-05 |
| 11830866 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2023-11-28 |
| 11830796 | Circuit substrate, package structure and method of manufacturing the same | Shih-Wei Chen, Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu +1 more | 2023-11-28 |
| 11823980 | Package structure and manufacturing method thereof | Tzuan-Horng Liu | 2023-11-21 |
| 11824017 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Tin-Hao Kuo, Shih-Wei Chen | 2023-11-21 |
| 11809000 | Photonic integrated circuit and package structure | Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Chung-Ming Weng, Hua-Kuei Lin +1 more | 2023-11-07 |
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Chung-Shi Liu, Chen-Hua Yu | 2023-10-24 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +5 more | 2023-09-26 |
| 11764171 | Integrated circuit structure and method | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo | 2023-09-19 |
| 11756731 | Programmable inductor | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2023-09-12 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh +5 more | 2023-09-12 |
| 11749582 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Chien Ling Hwang +4 more | 2023-09-05 |
| 11749640 | Semiconductor package and method of manufacturing the same | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2023-09-05 |
| 11741737 | Fingerprint sensor in info structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2023-08-29 |