Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854986 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-12-26 |
| 11824017 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2023-11-21 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Chen-Hua Yu, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11646296 | Semiconductor package and manufacturing method of semiconductor package | Hung-Yi Kuo, Hao-Yi Tsai, Kuo Lung Pan, Ting Hao Kuo, Yu-Chia Lai +3 more | 2023-05-09 |